Rok: 2018

Effect of temperature and carrier gas on the properties of thick InxAl1-xN layer

Effect of temperature and carrier gas on the properties of thick InxAl1-xN layer

Prerna Chauhan, Stanislav Hasenöhrl, Edmund Dobročka, Ľubomír Vančo, Roman Stoklas, Jaroslav Kováč, Peter Šiffalovič, Ján Kuzmík

doi.org/10.1016/j.apsusc.2018.10.231

Abstract

Thick (>150nm) InxAl1-xN layers were grown on GaN/sapphire (0001) by organometallic vapor phase epitaxy. Growth temperature of InxAl1-xN layers was reduced from 790 to 730°C, to examine the effects of growth temperature in InxAl1-xN layers grown under H2 carrier gas. Indium incorporation, surface morphology, electrical, and optical properties of InxAl1-xN layers were examined as a function of growth temperature. Increase in In-molar fraction, as determined by high resolution X-ray diffraction, was observed with decreasing growth temperature of InxAl1-xN layers at the expense of surface roughness. Unstrained InxAl1-xN layer was achieved at 730°C under H2 carrier gas with x=0.18. However, InxAl1-xN layer grown under N2 carrier gas at 730°C to study the effects of carrier gas, was observed with two times higher In-molar fraction (x=0.37) and one order lower carrier concentration. This work shows the essential requirement of a multi-characterization approach to establish a connection between structural, electrical, and optical properties to improve our understanding towards InxAl1-xN. Edge threading dislocations density is found to be the most important parameter in deciding the characteristics of an InxAl1-xN layer.

Adhesive-deformation relationships and mechanical properties of nc-AlCrN/a-SiNx hard coatings deposited at different bias voltages

Adhesive-deformation relationships and mechanical properties of nc-AlCrN/a-SiNx hard coatings deposited at different bias voltages

M. Haršáni, N. Ghafoor, K. Calamba, P. Zacková, M. Sahul, T. Vopát, L. Satrapinskyy, M. Čaplovičová, Ľ. Čaplovič,

Thin Solid Films, Volume 650, 2018, Pages 11-19

doi.org/10.1016/j.tsf.2018.02.006

Abstract

A series of Al-Cr-Si-N hard coatings were deposited on WC-Co substrates with a negative substrate bias voltage ranging from −50 to −200 V using cathodic arc evaporation system. A Rockwell-C adhesion test demonstrated that excellent adhesion was observed at lower bias voltages of −50 V and −80 V, while further increases in bias voltage up to −200 V led to severe delaminationand worsening of the overall adhesion strength. X-ray diffraction and transmission electron microscopy analysis revealed a single phase cubic B1-structure identified as an AlCrN solid solution with a nanocomposite microstructure where cubic AlCrN nanocrystals were embedded in a thin continuous amorphous SiNx matrix. Coatings exhibited a 002-texture evolution that was more pronounced at higher bias voltages (≥−120 V). Stress-induced cracks were observed inside the coatings at high bias voltages (≥−150 V), which resulted in stress relaxation and a decline in the overall residual stresses.